101. Hermeticity of electronic packages
Author: Hal Greenhouse, Robert Lowry, Bruce Romenesko.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging.,Electronics-- Materials-- Permeability.,Sealing (Technology)
Classification :
TK7870
.
15
.
G74
2012eb
102. Hermeticity of electronic packages
Author: by Hal Greenhouse.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging.,Electronics-- Materials-- Permeability.,Sealing (Technology)
Classification :
TK7870
.
15
.
G71
2000
103. Hermeticity of electronic packages
Author: Hal Greenhouse, Robert Lowry, Bruce Romenesko.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging.,Electronics-- Materials-- Permeability.,Sealing (Technology)
Classification :
TK7870
.
15
.
G74
2012eb
104. #High temperature electronics
پدیدآورنده : #edited by F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak
موضوع : Electronic apparatus and appliances- Thermal properties ،Electronic packaging ،Heat resistant materials
۴ نسخه از این کتاب در ۳ کتابخانه موجود است.
105. High temperature electronics
Author: edited by F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: ، Electronic apparatus and appliances- Thermal properties,، Electronic packaging,، Heat resistant materials
Classification :
TK
7870
.
25
.
H54
106. High temperature electronics /
Author: edited by F. Patrick McCluskey, Richard Grzybowski, Thomas Podlesak.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic apparatus and appliances-- Thermal properties.,Electronic packaging.,Heat resistant materials.,Electronic packaging.,Heat resistant materials.,Electronic apparatus and appliances-- Thermal properties.,Electronic packaging.,Heat resistant materials.,Materiais eletrônicos (propriedades térmicas),Microeletrônica.
Classification :
TK7870
.
25
.
H54
1997
107. IWIPP 2000 International Workshop on Integrated Power Packaging, July 14-15, 2000, Westin Hotel, Waltham, MA, USA
Author:
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: Congresses ، Electronic packaging,Congresses ، Power electronics
Classification :
TK
7870
.
15
.
I44
2000
108. Influence of temperature on microelectronics and system reliability
Author: Lall, Pradeep
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Microelectronics-- Materials-- Thermal properties,، Electronic packaging,، Elctronic apparatus and appliances-- Reliability
Classification :
TK
7870
.
25
.
L35
1997
109. Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
Author:
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Electronic packaging-- Design,، Hybrid integrated circuits-- Design and construction,، Multichip modules )Microelectronics(-- Design and construction
Classification :
TK
7870
.
15
.
P42
1994
110. LED packaging for lighting applications :
Author: Sheng Liu, Xiaobing Luo
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electric lighting-- Equipment and supplies,Electronic packaging,Light emitting diodes-- Computer simulation,Light emitting diodes-- Design and construction
Classification :
TK7871
.
89
.
L53
L58
2011
111. Lead-free soldering in electronics :
Author: edited by Katsuaki Suganuma.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging.,Solder and soldering.,Electronic packaging.,Solder and soldering.,TECHNOLOGY & ENGINEERING-- Electronics-- Digital.,TECHNOLOGY & ENGINEERING-- Electronics-- Microelectronics.
Classification :
TK7870
.
15
.
L43
2004eb
112. Lead-free soldering in electronics: science, technology and environmental impact
Author:
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Electronic packaging,، Solder and soldering
Classification :
TK
7870
.
15
.
L43
2004
113. Lead-free soldering in electronics: science, technology and environmental impact
Author: edited by Katsuaki Suganuma
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: ، Electronic packaging,، Solder and soldering
Classification :
TK
7870
.
15
.
L43
114. MCM C/Mixed Technologies and Thick Film Sensors :
Author: edited by W. Kinzy Jones, Karel Kurzweil, Gábor Harsányi, Sylvia Mergui.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic packaging -- Congresses.,Multichip modules (Microelectronics) -- Congresses.,Thick-film circuits -- Congresses.
Classification :
TK7870
.
15
E358
1995
115. Materials for advanced packaging
Author: ]edited by[ Daniel Lu, C.P. Wong
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Electronic packaging -- Materials
Classification :
TK
7870
.
15
.
M2
2009
116. Materials for advanced packaging
Author: / Daniel Lu, C.P. Wong, editors
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Microelectronic packaging.,Electronic packaging.
Classification :
TK
,
7874
,.
M38
,
2009
117. Materials for electronic packaging
Author:
Library: Central Library and Documents Center of Mazandaran University (Mazandaran)
Subject: Electronic packaging ; Materials. ;
118. Materials for electronic packaging
Author: / edited by Deborah D.L. Chung
Library: Central Library and Document Center of Shahid Chamran University (Khuzestan)
Subject: Electronic packaging--Materials
Classification :
TK
,
7870
.
15
,.
M38
,
1995
119. Mechanical analysis of electronic packaging systems
Author: Stephen A. McKeown
Library: Library of Urmia University of Technology (West Azarbaijan)
Subject: Electronic packaging,Mechanical engineering,System analysis
Classification :
TK
,
7870
.
15
,.
M42
,
1999
